Stress-Strain Analysis for Surface Mount Assembly.

Setup Optimization in High-Mix Surface Mount PCB Assembly Setup Optimization in High-Mix Surface Mount PCB Assembly

The thesis discusses machine setup problems which arise in high-mix, lowvolume production environments of printed circuit board assembly (PCB) industry. We concentrate especially on the hybrid setup problem that is a combination of the job grouping and minimum setup problems. We define an objective function that minimizes a weighted sum of the number of setup occasions and the number of feeder ...

Stress-strain analysis for the wheel-railtrack assembly at urban passenger transport

The analysis of the stress-strain state which occurs in the wheel-railtrack assembly of the common mean of urban passenger transportation (tram) represents an issue of high interest due to the fact that the mentioned assembly is subjected to high level of wear resulting in high costs for maintenance and operation at optimum parameters. The high level of wear represents an important source of vi...

Optimisation for Surface Mount Placement Machines

Optimisation of feeder setup and component placement sequence are very important to the efficiency of surface mount placement machines. Much works have been conducted to solve this problem. However, the technological characteristics of the placement machine influences the nature of the planning problems to be solved and the formulation of the associated models. As a result, little consensus exi...

Solder Paste Stencil for Surface Mount Technology

Solder paste masks or stenc.ils are an integral part of the manufacturing process for surface mount circuit boards. This study will examine the feasibility of developing a process for rapidly ' Currently at IUA-Tencor Corporation, San Jose, CA 0-7803-6482-1 /OO/$lO.OO 02000 IEEE 2000 IEEWCPMT Int'l Electronics Manufactluring Technology Symposium

Reflow Soldering Guidelines for Surface - Mount Devices